Abstract: In this paper, the potential influencing factors of BGA, such as shape, center distance and misalignment, were investigated and analyzed in the bands from DC to 20GHz by HFSS. In the model, ...

Jim DeLap is an Applications Engineer for Agilent EEsof EDA. He has worked in the microwave and RF community for over 13 years, and has a Master's degree from the University of Virginia. Jim has ...

• “Boulevard” routing for outer rows on the top layer using dogbones. • Inner rows escape to inner layers through strategically placed vias. • Keep solid ground/power planes directly beneath routing ...

I am Hiring for Intern @ Intel Technologies India, Bengaluru. He/She will be doing analysis on BGA simulation – Package BGA Solder ball crack analysis, Solder ball reliability analysis, LGA socket ...

You can create a release to package software, along with release notes and links to binary files, for other people to use. Learn more about releases in our docs.