Dnotitia Inc. (Dnotitia), a company specializing in long-term memory AI and semiconductor-integrated solutions, today announced that it has closed a KRW 90 billion Series A round. With the new funding ...

Crypto Quantique, a provider of quantum-driven security for the Internet of Things (IoT), has significantly boosted the performance of its semiconductor hardware IP, QDID, a NIST-compliant physical ...

Bosch, for example, has been a Tier 1 supplier of specialized computing units, processors, ABS hardware and semiconductors to global OEMs for years. However, as vehicles become more advanced, this ...

With the release of Chrome 145, the digital imaging industry has reached a pivotal milestone: universal native support for JPEG XL (jxl) across all major web browsers. By integrating a ...

When SK Hynix announced a strategic investment in Spanish RISC-V startup Semidynamics, the headline appeared straightforward: a memory company backing an emerging AI chip designer. But beneath the ...

QuickLogic Corporation (NASDAQ: QUIK), a developer of embedded FPGA (eFPGA) Hard IP, Strategic Radiation Hardened, Antifuse and ruggedized FPGAs, today announced the appointment of Quantum Leap ...

BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, today announced that ...

Synopsys broke onto the AI flash storage scene with a recent IP announcement. Synopsys is enabling a new generation of high-speed, low-power, high-efficiency storage for mobile edge-AI devices with ...

Samsung Foundry aims to win customers seeking alternatives, betting on improving 2nm yields and upcoming mass production ...

The continued evolution of automotive and industrial Ethernet is driving the need for more advanced validation and testing environments. Addressing this need, Omnitrx introduces Omni500, a ...

BOS Semiconductors, a fabless company specializing in Physical AI and automotive AI SOCs, announced that it will participate ...

To scale performance for AI workloads and other data-intensive applications, many chipmakers are adopting architectures that integrate multiple dies in a 3D package. These multi-die designs don’t just ...